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Arlanxeo plans EPDM capacity expansion in China - Chemical ...
These products are also commonly used to produce rail pads, railway sound barriers and rubber boots for the rail transit system, auto profile for new energy vehicles and washing machine gasket, air-conditioner damper in home appliances. “Arlanxeo is committed to meeting customers’ expectations for premium products and services.
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Recent trends and future of pharmaceutical packaging ...
The pharmaceutical packaging market is constantly advancing and has experienced annual growth of at least five percent per annum in the past few years. The market is now reckoned to be worth over $20 billion a year. As with most other packaged goods, ...
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Rethinking China’s Strategy of Technological Independence ...
Meanwhile, to increase its share in the critical industry, China should capitalize on its strengths in mass-producing older and more mature chips such as those fabricated with 14-nanometer and 28-nanometer technologies. These chips are of high demand and widely used in cars, central processing units, and mobile phones.
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Pouch Packaging Machines - Sachet Packing Machine Latest ...
All India Packing Machines Pvt Ltd. Contact Supplier. High Speed Pouch Packaging Machines. ₹ 7.50 Lakh. Durga Packaging Machine. Contact Supplier. Heat Way Matric Filler Tea Powder Pouch Packing Machine, For Commercial. ₹ 1.80 Lakh. Royal Pack Industries.
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Packaging Technology Needs Of Automotive Radar Sensors Chips
Packaging Technology Needs Of Automotive Radar Sensors Chips. From low-cost ultrasonic radar to complex lidar, automotive sensing methods call for a range of packaging types tailored to the application. Automotive radar systems are typically composed of an antenna, front-end radar sensor and back-end signal processor.
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Advanced Packaging - Semiconductor Engineering
Advanced packaging is a general grouping of a variety of distinct techniques, including 2.5D, 3D-IC, fan-out wafer-level packaging and system-in-package. While putting multiple chips in a package has been around for decades, the driver for advanced packaging is directly correlated with Moore’s Law. Wires are shrinking along with transistors, and the amount of distance that... » read more
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Enabling Cost-Effective, High-Performance Die-to-Die Connectivity
Die-to-die connectivity enables high-performance applications with cost-effective packaging. The Cadence UltraLink D2D PHY IP is a high-performance, low-latency PHY for die-to-die connectivity targeted at the AI/ML, 5G, cloud computing and networking market segments.
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Takeaway containers -- the environmental cost of packing our ...
Mar. 17, 2021 — Scientists have discovered a green, low-energy process to break down polystyrene, a type of plastic that is widely used in foam packaging materials, disposable food containers ...
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Global Current Sensor Market To Be Driven By Growing Use Of ...
The new report by Expert Market Research titled, ‘Global Current Sensor Market Report and Forecast 2021-2026’, gives an in-depth analysis of the
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Package Machines - Package Machines - Package Machines
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